ABOUT US
Aspire to be the leading creator of advanced semiconductor technology and products.
Company Profile
Guangdong 3D-Semi Co., Ltd.
Date of registration:Jan. 2022
Guangzhou Zengcheng Economic and Technological Development Zone Core Area
Total planned investment:6.6 billion
Current registered capital:550 million
Controlling Shareholders
XingCheng Capital
Bay Area Sensor Industry Group
Participating Shareholders
Guangzhou Finance Fund Management Co., Ltd.
Guangzhou Industrial Investment and Capital Operation Holding Group Ltd,.
Zengcheng Industrial Investment and Capital Operation Holding Group Ltd,.
Technical capabilities
Technical capabilities silicon interposer products using TSV technology up to aspect ratio 10:1 in 10μm via hole, micro-bump fabrication technology, permanent/ temporary bonding and debonding technology for ultra-thin wafers, 2.5D organic carrier board heteromaterial and heterostructure integration technology, etc.
Core competency
Core competency leading packaging solution development capability, excellent design and simulation capability, competitive processing and delivery capability.
Product direction
Product direction mainly involves in sensor chips, filter chips, artificial intelligence chips, 5G RF chips, high performance computing (HPC) chips, microprocessor chips, etc.
Application
Application Products are widely used in consumer electronics, automotive electronics, RF, security, high performance computing and other fields.
Leader Team
Freeman Chen
Chairman
Frank Lai
CEO
Ben Qi
VP
Weiguo Xu
CFO
Tony
Senior Director
Yuliang Fang
Engineering Director
Paul Ren
Deputy Director
Freeman Chen
Chairman
Frank Lai
CEO
Ben Qi
VP
Weiguo Xu
CFO
Tony
Senior Director
Yuliang Fang
Engineering Director
Paul Ren
Deputy Director
CULTURE
Corporate Vision
Corporate Vision Aspire to be the leading creator of advanced semiconductor technology and products.
Corporate Mission
Corporate Mission Leading advanced packaging technology, Surpassing the limitations of Moore's Law, Catching up with the international advanced level, Creating a better chip world together
Value
Value Innovation, empowerment, honesty and integrity
Quality Policy
Quality Policy Customer first, pragmatic and trustworthy, quality first, pursuit of excellence.
Environmental Policy
Environmental Policy Comply with laws and regulations, prevent pollution, provide green products that meet environmental requirements; full participation, continuous improvement, meet the requirements of customers and laws and regulations.
Corporate Vision
Aspire to be the leading creator of advanced semiconductor technology and products.
Corporate Mission
To lead the advanced packaging technology, surpass Moore's Law limit, catch up with the international advanced level, and create a better core world together.
Value
Innovation, empowerment, honesty and integrity
Quality Policy
Customer first, pragmatic and trustworthy, quality first, pursuit of excellence.
Environmental Policy
Comply with laws and regulations, prevent pollution, provide green products that meet environmental requirements; full participation, continuous improvement, meet the requirements of customers and laws and regulations.
Honors and Qualifications
Semiconductor-related patents 0
Invention patents 0
Authorized        0
Utility Model          0
Authorized 0
certificate of honor